Reliable Manufacturing of Wire-Bonding Tools

Tools for the electronics and semiconductor industry, reliably ground on the fully automated SCHNEEBERGER 5-axis grinding machine ARIES NGP SCARA.

Wire bonding is the fabrication of electrical connections, one of the process steps in chip production (integrated circuit packaging). The very fine bonding wire has a diameter of 10 to 75 micrometers. Accordingly, the bonding tools required for this must be ground to a tolerance of a few micrometers.

The 5-axis CNC grinding machine Aries NGP produces bonding tools fully automatically with Fanuc SCARA robots. The machine is characterized by maximum reliability and process stability. With Qg1 3D import, grinding programs can be easily created from a wide range of tool geometries.