Reliable Manufacturing of Wire-Bonding Tools
Tools for the electronics and semiconductor industry, reliably ground on the fully automated SCHNEEBERGER 5-axis grinding machine ARIES NGP SCARA.
Automated production of high-precision bonding tools on Aries NGP
Compact and reliable - the Aries NGP with Scara robot
Wire bonding is the fabrication of electrical connections, one of the process steps in chip production (integrated circuit packaging). The very fine bonding wire has a diameter of 10 to 75 micrometers. Accordingly, the bonding tools required for this must be ground to a tolerance of a few micrometers.
The 5-axis CNC grinding machine Aries NGP produces bonding tools fully automatically with Fanuc SCARA robots. The machine is characterized by maximum reliability and process stability. With Qg1 3D import, grinding programs can be easily created from a wide range of tool geometries.
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