Reliable Manufacturing of Wire-Bonding Tools
Tools for the electronics and semiconductor industry, reliably ground on the fully automated SCHNEEBERGER 5-axis grinding machine ARIES NGP SCARA.
Automated production of high-precision bonding tools on Aries NGP
Wire bonding is the fabrication of electrical connections, one of the process steps in chip production (integrated circuit packaging). The very fine bonding wire has a diameter of 10 to 75 micrometers. Accordingly, the bonding tools required for this must be ground to a tolerance of a few micrometers.
The 5-axis CNC grinding machine Aries NGP produces bonding tools fully automatically with Fanuc SCARA robots. The machine is characterized by maximum reliability and process stability. With Qg1 3D import, grinding programs can be easily created from a wide range of tool geometries.
News overview
Categories
All posts
- Live from CCMT Shanghai: Skiving Cutter Profiling, Shank Tool Grinding and more…
- Economical Regrinding of Large Tools with the Aries NGP+ from SCHNEEBERGER
- Fresh & Sharp in Quinto Qg1, release 2024-02
- In future, even more customers will be able to call a SCHNEEBERGER grinding machine their own. A new assembly plant makes this possible
- Happy Holidays